UV Laser Marking Machine for Non-metallic Materials Laser Marking
UV Laser Marking Machine for Non-metallic Materials Laser Marking
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
UV Laser Marking Machine for Non-metallic Materials Laser Marking
UV laser marking machine is developed by using a 355nm UV laser, it adopts third-order cavity frequency multiplication technology. Compared to infrared laser, the focusing spot of UV laser is much smaller, which helps to reduce the mechanical deformation of the materials to a large extent. It features of smaller heat affected area and more beautiful marking effect.
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Features:
1: High-precision marking, fast and controllable engraving depth.
2: Suitable for most non-metallic materials.
3: The beam quality is excellent, the photoelectric conversion efficiency is high, the performance is good, and it can be finely processed.
4: Adopt Windows interface, compatible with CORELDRAW, AUTOCAD, PHOTOSHOP, etc.
5: Support PLT, PCX, DXF, BMP and other formats, directly execute SHX, TTF fonts, support automatic codes, serial numbers, batch numbers, 2D barcode marking, and available anti-counterfeiting marking functions.
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers. Email: eda@dumanlaser.com
UV laser marking machine suitable for high-end market for ultra-fine processing, such as mobile phones, chargers, data cables, pharmaceutical packages,cosmetics packages, and polymer materials surface marking. Also it can be used for marking of flexible PCB boards, dicing micro-holes and blind holes for silicon wafers, LCDQA code marking, glassware punching, metal surface marking, plastic buttons, electronic components, gifts, communication equipment, building materials, etc. Email: eda@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Please send your inquiry to Email: eda@dumanlaser.com
Laser cutting machineis mainly applicable to all kinds of metal sheets: stainless steel, carbon steel, galvanized sheet, copper sheet, aluminum sheet, various alloy sheets, rare metals, etc. CFA series are widely used for cutting and forming of carbon steel, stainless steel, aluminum, copper and other metal materials. Please send your inquiry to Email:eda@dumanlaser.com
Laser cutting machine is mainly suitable for non-contact rapid cutting, hollowing and punching of various metal materials such as carbon steel plate, stainless steel plate, alloy steel, manganese steel, galvanized sheet, aluminum plate, and pipe. Please send your inquiry to Email: eda@dumanlaser.com
It is suitable for surface treatment of automobile forming dies, stamping dies, roll forging dies, extrusion dies, injection dies and die casting dies. Applicable materials: all kinds of die steel, carbon steel, chrome steel. Please send your inquiry to Email:eda@dumanlaser.com