It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Email: eda@dumanlaser.com
Item NO. :
DMM-UV7WPayment :
L/C D/A D/P T/T Western UnionProduct Origin :
ChinaShipping Port :
XiamenLead Time :
15 days2W 3W 5W 7W UV Laser Engraving Machine for LEO Wafer & Glass Marking
UV laser marking machine is developed by using a 355nm UV laser, it adopts third-order cavity frequency multiplication technology. Compared to infrared laser, the focusing spot of UV laser is much smaller, which helps to reduce the mechanical deformation of the materials to a large extent. It features of smaller heat affected area and more beautiful marking effect.
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Applicable Industry
Medicine, food, low voltage electric appliance, LEO wafer，touch screen ITO film, plastic and so on.
Product features
1. Cold laser, particularly suitable for micromachining
2. Air cooling
3. New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime
4. Third-order intracavity frequency doubling technology , tiny spot, basically no heat affected processing
5. Low power consuming, maintenance free, stable performance
Technical parameter
|
Laser power |
2W/3W/5W/7W |
|
Wavelength |
355nm |
|
Beam quality |
㎡＜1.3 |
|
Marking scope |
65×65/110×110/160×160mm(optional) |
|
Marking speed |
≤7000mm/s |
|
Min. line width |
0.01mm |
|
Min. Character |
0. 1mm |
|
Pulse energy |
150uj(20KHz) |
|
Repeat precision |
10-200KHz |
|
Power supply |
220V±10% 50Hz/12A |
|
Power consumption |
400W |
|
Working temperature |
5℃--35℃ |
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers. Email: eda@dumanlaser.com
UV laser marking machine suitable for high-end market for ultra-fine processing, such as mobile phones, chargers, data cables, pharmaceutical packages,cosmetics packages, and polymer materials surface marking. Also it can be used for marking of flexible PCB boards, dicing micro-holes and blind holes for silicon wafers, LCDQA code marking, glassware punching, metal surface marking, plastic buttons, electronic components, gifts, communication equipment, building materials, etc. Email: eda@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: eda@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: eda@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Please send your inquiry to Email: eda@dumanlaser.com
Laser Cladding Machines widely used in mining, coal, petroleum, metallurgical industry, cement machinery industry, electrical machinery industry, construction machinery, auto repair industry, printing industry, paper industry and other industries. Email: eda@dumanlaser.com
Laser cutting machineis mainly applicable to all kinds of metal sheets: stainless steel, carbon steel, galvanized sheet, copper sheet, aluminum sheet, various alloy sheets, rare metals, etc. CFA series are widely used for cutting and forming of carbon steel, stainless steel, aluminum, copper and other metal materials. Please send your inquiry to Email:eda@dumanlaser.com
The use oflaser cuttinghas the advantages of fast cutting speed, high production efficiency, good cutting quality, narrow slit, good material adaptability, no tool wear, no matter it is simple or complex parts, it can be precisely and quickly formed and cut at one time, with a high degree of automation and simple operation. Low labor intensity, no pollution, low noise, low production cost, can save a lot of manpower and material resources, and good economic benefits. Please send your inquiry to Email: eda@dumanlaser.com
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