It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Email: joy@dumanlaser.com
Item NO. :
DMM-UV7WPayment :
L/C D/A D/P T/T Western UnionProduct Origin :
ChinaShipping Port :
XiamenLead Time :
15 days2W 3W 5W 7W UV Laser Engraving Machine for LEO Wafer & Glass Marking
UV laser marking machine is developed by using a 355nm UV laser, it adopts third-order cavity frequency multiplication technology. Compared to infrared laser, the focusing spot of UV laser is much smaller, which helps to reduce the mechanical deformation of the materials to a large extent. It features of smaller heat affected area and more beautiful marking effect.
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Applicable Industry
Medicine, food, low voltage electric appliance, LEO wafer，touch screen ITO film, plastic and so on.
Product features
1. Cold laser, particularly suitable for micromachining
2. Air cooling
3. New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime
4. Third-order intracavity frequency doubling technology , tiny spot, basically no heat affected processing
5. Low power consuming, maintenance free, stable performance
Technical parameter
|
Laser power |
2W/3W/5W/7W |
|
Wavelength |
355nm |
|
Beam quality |
㎡＜1.3 |
|
Marking scope |
65×65/110×110/160×160mm(optional) |
|
Marking speed |
≤7000mm/s |
|
Min. line width |
0.01mm |
|
Min. Character |
0. 1mm |
|
Pulse energy |
150uj(20KHz) |
|
Repeat precision |
10-200KHz |
|
Power supply |
220V±10% 50Hz/12A |
|
Power consumption |
400W |
|
Working temperature |
5℃--35℃ |
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers. Email: joy@dumanlaser.com
UV laser marking machine suitable for high-end market for ultra-fine processing, such as mobile phones, chargers, data cables, pharmaceutical packages,cosmetics packages, and polymer materials surface marking. Also it can be used for marking of flexible PCB boards, dicing micro-holes and blind holes for silicon wafers, LCDQA code marking, glassware punching, metal surface marking, plastic buttons, electronic components, gifts, communication equipment, building materials, etc. Email: joy@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: joy@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: joy@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Please send your inquiry to Email: joy@dumanlaser.com
It is suitable for plastic auto parts, plastic medical equipment, plastic casings of electronic and electrical products, lighting products, etc. It is especially suitable for the welding of sensors and electronic component casings that require reliable sealing and pressure resistance. Please send your inquiry to Email: joy@dumanlaser.com
Laser Cleaning Machine is suitable for cleaning rust layers, thick paint layers, deep oil stains, rough surfaces and weld seams. It does not affect the surface of the substrate, and the efficiency is very high. Please send your inquiry to Email:joy@dumanlaser.com
UV laser depaneling systems are popular for their non-charring cutting process. Using specialized fixtures and machine vision, intricate boards are able to be cut with extremely tight tolerances. Perfect for microelectronics and medical device manufacturers. Please send your inquiry to Email: joy@dumanlaser.com
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