It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Email: eda@dumanlaser.com
Item NO. :
DMM-UV7WPayment :
L/C D/A D/P T/T Western UnionProduct Origin :
ChinaShipping Port :
XiamenLead Time :
15 days2W 3W 5W 7W UV Laser Engraving Machine for LEO Wafer & Glass Marking
UV laser marking machine is developed by using a 355nm UV laser, it adopts third-order cavity frequency multiplication technology. Compared to infrared laser, the focusing spot of UV laser is much smaller, which helps to reduce the mechanical deformation of the materials to a large extent. It features of smaller heat affected area and more beautiful marking effect.
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Applicable Industry
Medicine, food, low voltage electric appliance, LEO wafer，touch screen ITO film, plastic and so on.
Product features
1. Cold laser, particularly suitable for micromachining
2. Air cooling
3. New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime
4. Third-order intracavity frequency doubling technology , tiny spot, basically no heat affected processing
5. Low power consuming, maintenance free, stable performance
Technical parameter
|
Laser power |
2W/3W/5W/7W |
|
Wavelength |
355nm |
|
Beam quality |
㎡＜1.3 |
|
Marking scope |
65×65/110×110/160×160mm(optional) |
|
Marking speed |
≤7000mm/s |
|
Min. line width |
0.01mm |
|
Min. Character |
0. 1mm |
|
Pulse energy |
150uj(20KHz) |
|
Repeat precision |
10-200KHz |
|
Power supply |
220V±10% 50Hz/12A |
|
Power consumption |
400W |
|
Working temperature |
5℃--35℃ |
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers. Email: eda@dumanlaser.com
UV laser marking machine suitable for high-end market for ultra-fine processing, such as mobile phones, chargers, data cables, pharmaceutical packages,cosmetics packages, and polymer materials surface marking. Also it can be used for marking of flexible PCB boards, dicing micro-holes and blind holes for silicon wafers, LCDQA code marking, glassware punching, metal surface marking, plastic buttons, electronic components, gifts, communication equipment, building materials, etc. Email: eda@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: eda@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: eda@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Please send your inquiry to Email: eda@dumanlaser.com
It is suitable for precise surface heat treatment of various hardware tools, cutting tool edges, tool edges, valve sealing surfaces, small gears, small molds, gear ring gears, machine tool guides, motor shafts, reducer shafts and other mechanical parts. Please send your inquiry to Email: eda@dumanlaser.com
This CO2 Laser cutting machine uses imported linear guides and high-speed stepping motors and drivers to make the cutting effect smooth and without ripples. Applicable Material:Acrylic; Glass; Leather; MDF; Metal; Paper; Plastic; Plexiglax; Plywood; Rubber; Stone; Wood. Please send your inquiry to Email: eda@dumanlaser.com
It is suitable for welding all kinds of KN95 mask machine welding knives, mask machine welding gear shafts, embossing rollers, embossing shafts, cross-cutting knife sticks, knife pillows, knife molds, folding mask machine molds, rolling die cutters, gear shafts , cam and other standard parts and non-standard parts customized laser quenching equipment. Suitable materials: Cr12MoV, DC53, SKD11, 40Cr, 42CrMo, medium carbon steel and other commonly used die materials. Email: eda@dumanlaser.com
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