Contact Number

+86 18250801164
Products

High precision Laser Cutting Machine for Solar Panel PI film Roll to Sheet Roll to Roll Cut


UV laser depaneling systems are popular for their non-charring cutting process. Using specialized fixtures and machine vision, intricate boards are able to be cut with extremely tight tolerances. Perfect for microelectronics and medical device manufacturers.



Please send your inquiry to Email: joy@dumanlaser.com

  • Item NO. :

    DMC5060
  • Payment :

    L/C D/A D/P T/T Western Union
  • Product Origin :

    China
  • Shipping Port :

    Xiamen
  • Lead Time :

    15 days

High precision Laser Cutting Machine for Solar Panel PI film Roll to Sheet Roll to Roll Cut


Standard ultraviolet laser depaneling system configuration features a water-cooled UV laser with through the optics vision (TTOV) and an XY table for high-precision cutting of PCBs. UV laser depaneling systems are popular for their non-charring cutting process. Using specialized fixtures and machine vision, intricate boards are able to be cut with extremely tight tolerances. Perfect for microelectronics and medical device manufacturers.

Really cold working, no carbonization after production and processing; High cutting profile accuracy, neat and smooth edges without burrs after cutting, especially for fine arc and other micro cutting It will not cause any delamination to the cutting workpiece, and effectively reduce the forming unqualified rate.


Features

  1. Ultraviolet laser cutting source with XY table
  2. TTOV machine vision for high-speed locating of board fiducial markings
  3. Manual loading and unloading of fixture plates
  4. Specialized fixture plates designed for your specific board layouts
  5. Overall design features is dependent upon customer requirements
  6. Welded steel frame with aluminum paneling for long-lasting industrial use
  7. Ergonomic arm with 19” monitor, keyboard, and mouse or touchscreen display
  8. CDRH Class I laser workstation with emergency stop push button
  9. CMS LaserGraf5 software with Windows® 10 64-bit operating system


Specification

Item

Value

Laser Type

Picosecond/Nanosecond/UV

Cutting Area

500*610mm or customization

Cutting Speed

800mm/s

Graphic Format Supported

AI, PLT, DXF

Cooling Mode

water coolong

Laser power

10W/30W/35W

Positioning Accuracy

1um

processing speed

3000mm/s

processing accuracy

30um

Focus Spot

20um

Scan range of galavanometer

50*50um

Dimensions

2200*1500*1750mm

Weight (KG)

2500KG


Samples



         


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