High precision Laser Cutting Machine for Solar Panel PI film Roll to Sheet Roll to Roll Cut
Standard ultraviolet laser depaneling system configuration features a water-cooled UV laser with through the optics vision (TTOV) and an XY table for high-precision cutting of PCBs. UV laser depaneling systems are popular for their non-charring cutting process. Using specialized fixtures and machine vision, intricate boards are able to be cut with extremely tight tolerances. Perfect for microelectronics and medical device manufacturers.
Really cold working, no carbonization after production and processing; High cutting profile accuracy, neat and smooth edges without burrs after cutting, especially for fine arc and other micro cutting It will not cause any delamination to the cutting workpiece, and effectively reduce the forming unqualified rate.
Features
-
Ultraviolet laser cutting source with XY table
-
TTOV machine vision for high-speed locating of board fiducial markings
-
Manual loading and unloading of fixture plates
-
Specialized fixture plates designed for your specific board layouts
-
Overall design features is dependent upon customer requirements
-
Welded steel frame with aluminum paneling for long-lasting industrial use
-
Ergonomic arm with 19” monitor, keyboard, and mouse or touchscreen display
-
CDRH Class I laser workstation with emergency stop push button
-
CMS LaserGraf5 software with Windows® 10 64-bit operating system
Specification
Item
|
Value
|
Laser Type
|
Picosecond/Nanosecond/UV
|
Cutting Area
|
500*610mm or customization
|
Cutting Speed
|
800mm/s
|
Graphic Format Supported
|
AI, PLT, DXF
|
Cooling Mode
|
water coolong
|
Laser power
|
10W/30W/35W
|
Positioning Accuracy
|
1um
|
processing speed
|
3000mm/s
|
processing accuracy
|
30um
|
Focus Spot
|
20um
|
Scan range of galavanometer
|
50*50um
|
Dimensions
|
2200*1500*1750mm
|
Weight (KG)
|
2500KG
|
Samples